Telah dilakukan penelitian di Sekine Lab, YNU untuk void dengan ukuran sekitar 10 mikro meter yang muncul pada bahan clad tembaga-nikel. Proses pembuatan bahan uji dilakukan di Sumitomo Metal, Kansai area. (Sebagaimana dapat dilihat pada SEM fotograf).
The Cu/Ni clad specimens with a total thickness of 1»1,5 mm used for the tests have been produced by rolling and diffusion bonding process with various heat treatments; A (800 C/3min), B (1000 C/3min), C(1000 C/10min) and D (1000 C/60min). In the specimen A, no void is formed and in the other types of specimen, void formation and growth occur depending the condition of heat treatment.
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